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TPA2012D2YZHR - Texas Instruments

Description: 2.1-W Stereo Class-D Audio Amplifier with Gain Select (TPA2012)

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TPA2012D2YZHR - Texas Instruments PCB footprint - BGA - BGA - YZH(S-XBGA-N16)(H=0.625mm)
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TPA2012D2YZHR - Texas Instruments  - 3D model - BGA - YZH(S-XBGA-N16)(H=0.625mm)
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TPA2012D2YZHR Details

  • Manufacturer Part Number:

    TPA2012D2YZHR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    16

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Gain:

    24 dB

  • Harmonic Distortion:

    10%

  • JESD-30 Code:

    S-PBGA-B16

  • JESD-609 Code:

    e1

  • Length:

    2.295 mm

  • Moisture Sensitivity Level:

    1

  • Noise Figure-Nom:

    95 dB

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    2.1 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA16,4X4,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.625 mm

  • Supply Current-Max:

    9 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.295 mm

TPA2012D2YZHR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TPA2012D2YZHR evaluation module documentation, which includes guidelines for component placement, trace routing, and thermal management to minimize noise and ensure optimal performance.
  • The gain setting depends on the input signal level and the desired output power. The TPA2012D2YZHR has a gain range of 6 dB to 26 dB. Use the gain equation in the datasheet to calculate the required gain setting based on your input signal level and desired output power.
  • The maximum power dissipation of the TPA2012D2YZHR is dependent on the ambient temperature and the thermal resistance of the PCB. According to the datasheet, the maximum power dissipation is 2.5 W at 25°C ambient temperature. However, this value can be derated based on the thermal resistance of the PCB and the ambient temperature.
  • The TPA2012D2YZHR has an internal overvoltage protection (OVP) circuit that limits the input voltage to 12 V. However, it is still recommended to add external overvoltage protection circuitry to protect the device from voltage transients and spikes. Additionally, an undervoltage lockout (UVLO) circuit can be implemented to prevent the device from operating at low input voltages.
  • The recommended input capacitor value is 1 μF to 10 μF, with a voltage rating of at least 10 V. A ceramic or film capacitor with low equivalent series resistance (ESR) is recommended to minimize noise and ensure optimal performance.

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TPA2012D2YZHR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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