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TPA2013D1RGPR - Texas Instruments

Description: 2.7-W Constant Output Power Mono Class-D Audio Amplifier with Integrated Boost Converter (TPA2013)

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TPA2013D1RGPR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - TPA2013D1RGPR
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TPA2013D1RGPR - Texas Instruments  - 3D model - Quad Flat No-Lead - TPA2013D1RGPR
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TPA2013D1RGPR Details

  • Manufacturer Part Number:

    TPA2013D1RGPR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    20

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • JESD-30 Code:

    S-PQCC-N20

  • JESD-609 Code:

    e4

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Noise Figure-Nom:

    95 dB

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    2.7 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC20,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    6 mA

  • Supply Voltage-Max (Vsup):

    5.2 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

TPA2013D1RGPR Frequently Asked Questions (FAQs)

  • According to TI's application notes, a 10uF ceramic capacitor and a 1uF ceramic capacitor in parallel, placed close to the power pins, are recommended for power supply decoupling.
  • The gain setting depends on the input signal level and the desired output power. TI provides a gain calculation formula in the datasheet. Additionally, the TPA2013D1RGPR evaluation module can be used to experiment with different gain settings.
  • The maximum power dissipation of the TPA2013D1RGPR is dependent on the ambient temperature and the thermal resistance of the PCB. TI provides a power dissipation calculation formula in the datasheet. Typically, the maximum power dissipation is around 2.5W.
  • To protect the TPA2013D1RGPR from overheating, ensure good thermal design practices, such as using a heat sink, keeping the device away from heat sources, and providing adequate airflow. Additionally, the thermal shutdown feature can be used to prevent damage from overheating.
  • TI provides a recommended PCB layout in the datasheet, which includes keeping the power supply traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device.

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TPA2013D1RGPR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TPA2013D1RGPT Texas Instruments

2.7W, 1 Channel(s), 1 Func, PQCC20