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TPA2013D1YZHR - Texas Instruments

Description: 2.7-W Constant Output Power Mono Class-D Audio Amplifier with Integrated Boost Converter (TPA2013)

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TPA2013D1YZHR - Texas Instruments - PCB symbol
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PCB Footprints
TPA2013D1YZHR - Texas Instruments PCB footprint - BGA - BGA - YZH0016_2021
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3D Models
TPA2013D1YZHR - Texas Instruments - 3D model - BGA - YZH0016_2021
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TPA2013D1YZHR Details

  • Manufacturer Part Number:

    TPA2013D1YZHR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    16

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Gain:

    36 dB

  • JESD-30 Code:

    S-PBGA-B16

  • JESD-609 Code:

    e1

  • Length:

    2.295 mm

  • Moisture Sensitivity Level:

    1

  • Noise Figure-Nom:

    95 dB

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    2.7 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA16,4X4,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.625 mm

  • Supply Current-Max:

    6 mA

  • Supply Voltage-Max (Vsup):

    5.2 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.295 mm

TPA2013D1YZHR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TPA2013D1YZHR evaluation module documentation, which includes guidelines for component placement, trace routing, and thermal management to minimize noise and ensure optimal performance.
  • The gain setting depends on the input signal level and the desired output power. The TPA2013D1YZHR has a gain range of 6 dB to 26 dB. Use the gain equation in the datasheet to calculate the required gain setting based on your input signal level and desired output power.
  • The maximum power dissipation of the TPA2013D1YZHR is dependent on the ambient temperature and the thermal resistance of the PCB. Use the thermal resistance values provided in the datasheet to calculate the maximum power dissipation for your specific application.
  • Use voltage regulators and overvoltage protection (OVP) circuits to ensure that the supply voltage to the TPA2013D1YZHR remains within the recommended operating range. Additionally, use undervoltage lockout (UVLO) circuits to prevent the device from operating during undervoltage conditions.
  • The recommended input coupling capacitor value depends on the input signal frequency and impedance. A general guideline is to use a capacitor value between 1 μF to 10 μF, with a voltage rating that exceeds the maximum input signal amplitude.

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TPA2013D1YZHR Overview

Use the download button to access the TPA2013D1YZHR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TPA20, or try a keyword search, such as Audio/Video Amplifiers

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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