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TPA2016D2RTJR - Texas Instruments

Description: 2.8-W/Ch Stereo Class-D Audio Amplifier with SmartGainTM AGC/DRC (TPA2016)

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PCB Footprints
TPA2016D2RTJR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RTJ(S-PWQFN-N20)
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3D Models
TPA2016D2RTJR - Texas Instruments  - 3D model - Quad Flat No-Lead - RTJ(S-PWQFN-N20)
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TPA2016D2RTJR Details

  • Manufacturer Part Number:

    TPA2016D2RTJR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    20

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • JESD-30 Code:

    S-PQCC-N20

  • JESD-609 Code:

    e4

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    2

  • Noise Figure-Nom:

    95 dB

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    2.8 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC20,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    5.5 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

TPA2016D2RTJR Frequently Asked Questions (FAQs)

  • A good thermal design should include a solid ground plane, thermal vias under the device, and a heat sink if possible. Refer to the TI application note 'TPA2016D2 Thermal Design Considerations' for more information.
  • To ensure stability, follow the recommended component values and PCB layout guidelines in the datasheet. Additionally, use a low-ESR capacitor for the bootstrap capacitor (C2) and keep the input and output traces short and symmetrical.
  • The maximum power dissipation of the TPA2016D2 is dependent on the ambient temperature and the thermal resistance of the PCB. Refer to the datasheet's thermal characteristics table to determine the maximum power dissipation for your specific application.
  • While the TPA2016D2 can operate with a lower voltage power supply, the output power and efficiency will be reduced. The minimum recommended voltage is 8V, but this may not provide sufficient headroom for some applications.
  • Use a voltage regulator or a transient voltage suppressor (TVS) to protect the amplifier from overvoltage. For ESD protection, use a TVS or a dedicated ESD protection device, such as the TI TPD1E10B06.

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TPA2016D2RTJR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TPA2016D2RTJT Texas Instruments

2.8W, 2 Channel(s), 1 Func, PQCC20