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TPA2016D2RTJT - Texas Instruments

Description: 2.8-W/Ch Stereo Class-D Audio Amplifier with SmartGainTM AGC/DRC (TPA2016)

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PCB Footprints
TPA2016D2RTJT - Texas Instruments PCB footprint - Other - Other - QFN50P400X400X80-21N
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3D Models
TPA2016D2RTJT - Texas Instruments  - 3D model - Other - QFN50P400X400X80-21N
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TPA2016D2RTJT Details

  • Manufacturer Part Number:

    TPA2016D2RTJT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    20

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • JESD-30 Code:

    S-PQCC-N20

  • JESD-609 Code:

    e4

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    2

  • Noise Figure-Nom:

    95 dB

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    2.8 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC20,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    5.5 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

TPA2016D2RTJT Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TPA2016D2RTJT datasheet, which includes guidelines for component placement, trace routing, and thermal management. Following this layout can help minimize noise, reduce electromagnetic interference (EMI), and ensure optimal thermal performance.
  • The gain setting of the TPA2016D2RTJT depends on the specific requirements of your application. You can use the gain setting formula provided in the datasheet to calculate the desired gain based on your input signal level and desired output power. Additionally, you can use the device's gain selection pins (GAIN0 and GAIN1) to set the gain to one of six possible settings (20dB, 26dB, 30dB, 34dB, 38dB, or 42dB).
  • The maximum power dissipation of the TPA2016D2RTJT depends on the ambient temperature and the thermal resistance of the PCB. According to the datasheet, the maximum power dissipation is 2.5W at an ambient temperature of 25°C, with a thermal resistance of 30°C/W. However, this value can be derated at higher temperatures. It's essential to ensure proper thermal management to prevent overheating and ensure reliable operation.
  • The TPA2016D2RTJT has built-in overvoltage protection (OVP) and undervoltage protection (UVP) circuits. However, it's still recommended to add external protection components, such as voltage regulators and transient voltage suppressors, to ensure that the device operates within its recommended voltage range (4.5V to 18V). Additionally, you can use a voltage monitor circuit to detect and respond to overvoltage and undervoltage conditions.
  • The recommended input coupling capacitor value for the TPA2016D2RTJT depends on the specific requirements of your application. A general guideline is to use a capacitor with a value between 1uF and 10uF, with a voltage rating that exceeds the maximum input signal voltage. A larger capacitor value can help filter out high-frequency noise, but may also increase the device's turn-on time.

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TPA2016D2RTJT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TPA2016D2RTJR Texas Instruments

2.8W, 2 Channel(s), 1 Func, PQCC20