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TPA2018D1YZFT - Texas Instruments

Description: Class-D Audio Amplifier

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TPA2018D1YZFT - Texas Instruments PCB footprint - Other - Other - BGA9C50P3X3_162X162X63
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TPA2018D1YZFT Details

  • Manufacturer Part Number:

    TPA2018D1YZFT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    9

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • JESD-30 Code:

    S-PBGA-B9

  • JESD-609 Code:

    e1

  • Length:

    1.6245 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    9

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    3 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA9,3X3,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.625 mm

  • Supply Current-Max:

    3.5 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6245 mm

TPA2018D1YZFT Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TPA2018D1YZFT datasheet, which includes a thermal pad connected to a large copper area on the PCB to dissipate heat. Additionally, it's recommended to use a 4-layer PCB with a solid ground plane to reduce electromagnetic interference (EMI).
  • The gain setting of the TPA2018D1YZFT depends on the input signal level and the desired output power. The datasheet provides a gain setting table that can be used to select the correct gain setting based on the input signal level. Additionally, the gain can be adjusted using external resistors to achieve the desired gain.
  • The maximum power dissipation of the TPA2018D1YZFT is dependent on the ambient temperature and the thermal resistance of the PCB. The datasheet provides a power dissipation calculation formula that can be used to determine the maximum power dissipation based on the specific application conditions.
  • The TPA2018D1YZFT has built-in overvoltage protection (OVP) and undervoltage protection (UVP) circuits that prevent the device from operating outside of its recommended voltage range. Additionally, external voltage regulators and protection circuits can be used to further protect the device from voltage transients and faults.
  • The recommended input coupling capacitor value for the TPA2018D1YZFT depends on the input signal frequency and the desired high-pass filter cutoff frequency. A general rule of thumb is to use a capacitor value between 1uF to 10uF, with a higher value providing a lower cutoff frequency.

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TPA2018D1YZFT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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