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TPA3007D1PW - Texas Instruments

Description: Texas Instruments TPA3007D1PW Audio Amplifier IC, Class-D Mono, 24-Pin TSSOP

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TPA3007D1PW - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW (R-PDSO-G24)
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TPA3007D1PW - Texas Instruments  - 3D model - Small Outline Packages - PW (R-PDSO-G24)
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TPA3007D1PW Details

  • Manufacturer Part Number:

    TPA3007D1PW

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    24

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Gain:

    36 dB

  • Harmonic Distortion:

    1%

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e4

  • Length:

    7.8 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    6.5 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    15 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

TPA3007D1PW Frequently Asked Questions (FAQs)

  • According to TI's application notes, a 10uF ceramic capacitor and a 1uF ceramic capacitor in parallel, placed close to the power pins, are recommended for power supply decoupling.
  • TI recommends a 4-layer PCB with a solid ground plane, and to keep the audio signal traces away from the power supply traces. Also, use a star-grounding configuration to minimize noise and hum.
  • The maximum power dissipation of the TPA3007D1PW is 15W, assuming a 25°C ambient temperature and a 4-layer PCB with a solid ground plane.
  • Yes, the TPA3007D1PW can be used in a bridged configuration, but it requires an external amplifier to drive the other half of the bridge. TI provides an application note (SLAA443) that details the design considerations for a bridged amplifier.
  • TI recommends using a voltage supervisor (such as the TLV7031) to monitor the power supply voltage and reset the amplifier if it falls outside the recommended operating range.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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