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TPA3007D1PWG4 - Texas Instruments

Description: Audio Amplifiers Mono Med Power Filter-Free Class-D

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PCB Footprints
TPA3007D1PWG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW0024A
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TPA3007D1PWG4 - Texas Instruments  - 3D model - Small Outline Packages - PW0024A
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TPA3007D1PWG4 Details

  • Manufacturer Part Number:

    TPA3007D1PWG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    24

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Gain:

    36 dB

  • Harmonic Distortion:

    1%

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e4

  • Length:

    7.8 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    6.5 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    15 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

TPA3007D1PWG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, which includes guidelines for component placement, thermal management, and routing. It's essential to follow these guidelines to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The input and output capacitors should be selected based on the amplifier's frequency response, impedance, and power handling requirements. TI recommends using X7R or X5R ceramic capacitors with a voltage rating of at least 10V. The capacitor values should be chosen to ensure a stable amplifier operation and to filter out high-frequency noise.
  • The maximum power dissipation of the TPA3007D1PWG4 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 3.5W at 25°C ambient temperature. However, this value can be derated based on the operating temperature and the thermal resistance of the PCB.
  • To protect the TPA3007D1PWG4 from overvoltage and overcurrent, TI recommends using voltage regulators, such as the TLV703 or TLV704, to regulate the supply voltage. Additionally, current-limiting resistors or fuses can be used to prevent overcurrent conditions. It's also essential to ensure that the amplifier is operated within its recommended operating conditions.
  • To ensure reliable operation, it's essential to implement an effective thermal management strategy for the TPA3007D1PWG4. This can include using thermal vias, heat sinks, and thermal interface materials to dissipate heat away from the device. The PCB should be designed to minimize thermal resistance and ensure good airflow around the device.

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TPA3007D1PWG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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