SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.1 mm
Supply Current-Max:
1.5 mA
Supply Voltage-Max (Vsup):
5.5 V
Supply Voltage-Min (Vsup):
2.5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
NICKEL PALLADIUM GOLD SILVER
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
3 mm
TPA301DGNRG4 Frequently Asked Questions (FAQs)
Texas Instruments provides a recommended PCB layout in the TPA301DGNRG4 datasheet (Section 10.2) and in the application note SLAA701. The layout should prioritize thermal dissipation, with a solid ground plane and thermal vias under the IC.
The input capacitor values depend on the input signal frequency, amplitude, and source impedance. A good starting point is to use the values recommended in the datasheet (Section 8.2.1). For more complex applications, TI provides an online capacitor selection tool.
The maximum power dissipation of the TPA301DGNRG4 is dependent on the ambient temperature and the thermal resistance of the PCB. According to the datasheet (Section 6.2), the maximum power dissipation is 3.5W at 25°C ambient temperature, but this can be derated for higher temperatures.
Yes, the TPA301DGNRG4 can be used in a bridged configuration to increase the output power. However, this requires careful consideration of the output stage design, including the output filter and load impedance. TI provides guidance on bridged configurations in the application note SLAA702.
The TPA301DGNRG4 has built-in overvoltage protection (OVP) and undervoltage protection (UVP) circuits. However, additional external protection circuits may be required depending on the application. TI recommends using a voltage supervisor IC, such as the TLV7031, to provide additional protection.
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
