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TPA3100D2RGZR - Texas Instruments

Description: 20-W Stereo Class-D Audio Power Amplifier (TPA3100)

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TPA3100D2RGZR - Texas Instruments - PCB symbol
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PCB Footprints
TPA3100D2RGZR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGZ0048A_H=1
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TPA3100D2RGZR - Texas Instruments - 3D model - Quad Flat No-Lead - RGZ0048A_H=1
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TPA3100D2RGZR Details

  • Manufacturer Part Number:

    TPA3100D2RGZR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    48

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    22 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Gain:

    36 dB

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Noise Figure-Nom:

    102 dB

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    20 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC44,.28SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    26 mA

  • Supply Voltage-Max (Vsup):

    26 V

  • Supply Voltage-Min (Vsup):

    10 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

TPA3100D2RGZR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TPA3100D2RGZR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended layout in the datasheet and application notes.
  • The gain setting depends on the input signal level, desired output power, and system impedance. TI provides a gain setting table in the datasheet, and you can also use the TI Audio Amplifier Gain Calculator tool to help select the optimal gain setting.
  • The maximum power dissipation of the TPA3100D2RGZR is dependent on the ambient temperature and the thermal resistance of the PCB. TI provides a power dissipation calculation formula in the datasheet, and you can also use the TI Power Dissipation Calculator tool to estimate the maximum power dissipation.
  • To protect the TPA3100D2RGZR from overheating, ensure good thermal conduction by using a heat sink or a thermally conductive PCB, keep the device away from heat sources, and implement thermal monitoring and shutdown circuits if necessary.
  • The recommended input coupling capacitor value depends on the input signal frequency and impedance. A general rule of thumb is to use a capacitor with a value of 1-10 μF, but TI recommends consulting the datasheet and application notes for specific guidance.

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TPA3100D2RGZR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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