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TPA3100D2RGZTG4 - Texas Instruments

Description: Audio Amplifiers 20 W Stereo Class-D Audio Amp

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TPA3100D2RGZTG4 - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGZ0048A 2021-1
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TPA3100D2RGZTG4 - Texas Instruments  - 3D model - Quad Flat No-Lead - RGZ0048A 2021-1
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TPA3100D2RGZTG4 Details

  • Manufacturer Part Number:

    TPA3100D2RGZTG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Package Description:

    7 X 7 MM, GREEN, PLASTIC, VQFN-48

  • Pin Count:

    48

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Bandwidth-Nom:

    22 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Gain:

    36 dB

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Noise Figure-Nom:

    102 dB

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    21.8 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC44,.28SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    26 mA

  • Supply Voltage-Max (Vsup):

    26 V

  • Supply Voltage-Min (Vsup):

    10 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

TPA3100D2RGZTG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TPA3100D2RGZTG4 datasheet, which includes guidelines for component placement, trace routing, and thermal management. Additionally, the TI website offers a PCB layout example and a thermal design guide for the TPA3100D2RGZTG4.
  • The input capacitor values for the TPA3100D2RGZTG4 depend on the input signal frequency, amplitude, and source impedance. A general guideline is to use a capacitor with a value between 1uF to 10uF, with a voltage rating that exceeds the maximum input voltage. TI also provides a capacitor selection guide in the datasheet.
  • The maximum power dissipation of the TPA3100D2RGZTG4 is dependent on the ambient temperature and the thermal resistance of the PCB. According to the datasheet, the maximum power dissipation is 10W at 25°C ambient temperature, with a thermal resistance of 30°C/W. However, it's recommended to perform thermal analysis and simulation to determine the maximum power dissipation for a specific application.
  • Yes, the TPA3100D2RGZTG4 can be used in a bridged configuration to increase the output power. However, this requires careful consideration of the output stage configuration, input signal phase, and output load impedance. TI provides a bridged amplifier configuration example in the datasheet, along with guidelines for component selection and PCB layout.
  • Troubleshooting common issues with the TPA3100D2RGZTG4 requires a systematic approach. Start by verifying the PCB layout, component values, and input signal integrity. Check for oscillation by monitoring the output signal with an oscilloscope, and verify that the input signal is within the recommended amplitude and frequency range. For distortion issues, check the output stage configuration, output load impedance, and power supply voltage. TI also provides a troubleshooting guide in the datasheet and application notes.

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TPA3100D2RGZTG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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