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TPA311DGN - Texas Instruments

Description: TPA311DGN, Speaker Audio Amplifier Class-AB mono/stereo 1.4MHz +85 °C 8-Pin HTSSOP EP, MSOP EP

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TPA311DGN - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN (S-PDSO-G8)
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TPA311DGN - Texas Instruments  - 3D model - Small Outline Packages - DGN (S-PDSO-G8)
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TPA311DGN Details

  • Manufacturer Part Number:

    TPA311DGN

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    10 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Harmonic Distortion:

    0.5%

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    0.35 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    1.5 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TPA311DGN Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TPA311DGN datasheet (section 10.2) and in the application note SLAA461. The layout should prioritize heat dissipation, with thermal vias and a solid ground plane to help dissipate heat.
  • The input capacitor values depend on the input signal frequency, amplitude, and source impedance. A general rule of thumb is to choose a capacitor with a value between 1uF to 10uF, with a voltage rating that exceeds the maximum input voltage. TI also provides a capacitor selection guide in the datasheet (section 8.2).
  • The maximum power dissipation of the TPA311DGN is dependent on the ambient temperature, PCB layout, and heat sinking. The datasheet provides a power dissipation calculation formula (section 10.1) that takes into account the output power, supply voltage, and efficiency. Typically, the maximum power dissipation is around 20W to 30W.
  • The TPA311DGN has built-in overvoltage protection (OVP) and undervoltage protection (UVP) circuits. However, additional external protection circuits may be necessary depending on the application. TI recommends using a voltage supervisor or a power-on reset circuit to ensure the device operates within the recommended voltage range.
  • The recommended operating voltage range for the TPA311DGN is 8V to 26V, with a typical operating voltage of 12V to 18V. Operating the device outside of this range may affect its performance, efficiency, and reliability.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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