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TPA311DGNRG4 - Texas Instruments

Description: Audio Amplifiers 0.35-W Mono Audio Power Amplifier

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TPA311DGNRG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN (S-PDSO-G8)
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TPA311DGNRG4 - Texas Instruments  - 3D model - Small Outline Packages - DGN (S-PDSO-G8)
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TPA311DGNRG4 Details

  • Manufacturer Part Number:

    TPA311DGNRG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MSOP

  • Package Description:

    GREEN, PLASTIC, MSOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Bandwidth-Nom:

    10 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Gain:

    20 dB

  • Harmonic Distortion:

    0.5%

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    0.7 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    1.5 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TPA311DGNRG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also important to follow general high-frequency PCB design guidelines, such as keeping the signal paths short, using a solid ground plane, and avoiding vias under the IC. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The input capacitor values depend on the input signal frequency and amplitude. A general rule of thumb is to choose a capacitor value that is at least 10 times the input impedance of the amplifier. For example, if the input impedance is 10kΩ, a 100nF capacitor would be a good starting point. It's also important to consider the capacitor's ESR (Equivalent Series Resistance) and ESL (Equivalent Series Inductance) when selecting the capacitor.
  • The maximum power dissipation of the TPA311DGNRG4 is dependent on the ambient temperature and the thermal resistance of the PCB. According to the datasheet, the maximum power dissipation is 3.5W at 25°C ambient temperature. However, this value can be derated based on the ambient temperature and the thermal resistance of the PCB. It's recommended to use a thermal pad and a heat sink to improve heat dissipation.
  • The TPA311DGNRG4 has built-in overvoltage protection (OVP) and undervoltage protection (UVP) circuits. However, it's still recommended to add external protection circuits, such as a voltage regulator and a voltage supervisor, to ensure that the amplifier is protected from voltage transients and faults. Additionally, it's recommended to use a fuse or a current limiter to protect the amplifier from overcurrent conditions.
  • The recommended output filter configuration for the TPA311DGNRG4 is a 2nd-order LC filter with a cutoff frequency of around 50kHz to 100kHz. This filter configuration helps to reduce the output noise and distortion. The values of the inductor and capacitor can be calculated based on the desired cutoff frequency and the output impedance of the amplifier.

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TPA311DGNRG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TPA311DGN Texas Instruments

Audio Amplifier, 0.35W, 1 Channel(s), 1 Func, CMOS, PDSO8

Part Image TPA311DGNR Texas Instruments

Audio Amplifier, 0.35W, 1 Channel(s), 1 Func, CMOS, PDSO8