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TPA3130D2DAP - Texas Instruments

Description: Texas Instruments TPA3130D2DAP 2-Channel Audio Amplifier IC, Class-D Mono/Stereo, 32-Pin HTSSOP

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TPA3130D2DAP - Texas Instruments - PCB symbol
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TPA3130D2DAP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DAP (R-PDSO-G32)
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TPA3130D2DAP - Texas Instruments - 3D model - Small Outline Packages - DAP (R-PDSO-G32)
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TPA3130D2DAP Details

  • Manufacturer Part Number:

    TPA3130D2DAP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    22 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Gain:

    36 dB

  • JESD-30 Code:

    R-PDSO-G32

  • JESD-609 Code:

    e4

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Noise Figure-Nom:

    102 dB

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    15 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP32,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    50 mA

  • Supply Voltage-Max (Vsup):

    26 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

TPA3130D2DAP Frequently Asked Questions (FAQs)

  • A good PCB layout for the TPA3130D2DAP involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended layout in the datasheet and application notes.
  • The gain setting depends on the input signal level and the desired output power. A higher gain setting can provide more output power, but may also increase noise and distortion. TI provides a gain setting calculator tool to help with this selection.
  • The maximum power dissipation of the TPA3130D2DAP is dependent on the ambient temperature and the thermal resistance of the PCB. TI provides a thermal derating curve in the datasheet to help estimate the maximum power dissipation.
  • The TPA3130D2DAP has built-in overvoltage protection, but it's still recommended to add external protection circuitry, such as a voltage regulator and TVS diodes, to protect against overvoltage and undervoltage conditions.
  • The recommended input coupling capacitor value depends on the input signal frequency and impedance. A general rule of thumb is to use a capacitor with a value of 1-10uF, but TI recommends consulting the datasheet and application notes for specific guidance.

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TPA3130D2DAP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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