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TPA3137D2PWP - Texas Instruments

Description: Inductor Free Stereo (BTL) 6W Class-D Audio Amplifier with ultra low EMI

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TPA3137D2PWP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - pwp(r-pdso-g28)-ren1
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TPA3137D2PWP - Texas Instruments  - 3D model - Small Outline Packages - pwp(r-pdso-g28)-ren1
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TPA3137D2PWP Details

  • Manufacturer Part Number:

    TPA3137D2PWP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2016-06-20

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    22 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Gain:

    26 dB

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e4

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    3

  • Noise Figure-Nom:

    102 dB

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    6 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    40 mA

  • Supply Voltage-Max (Vsup):

    14.4 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

TPA3137D2PWP Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also important to follow general high-frequency PCB design guidelines, such as keeping the signal traces short and away from the power traces, and using a solid ground plane.
  • The input capacitor value depends on the input impedance of the amplifier and the frequency response required. A general rule of thumb is to choose a capacitor value that is at least 10 times the input impedance of the amplifier. For example, if the input impedance is 1kΩ, a 10uF capacitor would be a good starting point.
  • The maximum power dissipation of the TPA3137D2PWP is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 3.5W at 25°C ambient temperature. However, it's recommended to derate the power dissipation based on the actual operating conditions.
  • Yes, the TPA3137D2PWP can be used in a bridged configuration to increase the output power. However, it's important to follow the guidelines in the datasheet for bridged operation, including using a common-mode feedback capacitor and ensuring that the output stages are properly biased.
  • To filter out noise and EMI, it's recommended to use a combination of passive components, such as ferrite beads and capacitors, to filter out high-frequency noise. Additionally, using a shielded enclosure and keeping the signal traces away from the power traces can help reduce EMI.

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TPA3137D2PWP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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