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TPA3255DDV - Texas Instruments

Description: Audio Amplifiers 325-W Stereo High-Performance, High-Definition, Class-D Amplifier 44-HTSSOP 0 to 70

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TPA3255DDV - Texas Instruments - PCB symbol
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TPA3255DDV - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DDV0044D
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TPA3255DDV - Texas Instruments - 3D model - Small Outline Packages - DDV0044D
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TPA3255DDV Details

  • Manufacturer Part Number:

    TPA3255DDV

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2016-09-15

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Gain:

    21.5 dB

  • JESD-30 Code:

    R-PDSO-G44

  • JESD-609 Code:

    e4

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Noise Figure-Nom:

    112 dB

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    44

  • Operating Temperature-Max:

    70 °C

  • Output Power-Nom:

    315 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    13.2 V

  • Supply Voltage-Min (Vsup):

    10.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

TPA3255DDV Frequently Asked Questions (FAQs)

  • A good PCB layout for the TPA3255DDV involves keeping the power traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. TI provides a recommended layout in the datasheet and application notes.
  • The gain setting for the TPA3255DDV depends on the specific application requirements. A good starting point is to use the recommended gain settings in the datasheet, and then adjust based on the desired output power and THD. TI also provides a gain calculator tool to help with this process.
  • The maximum power dissipation for the TPA3255DDV is dependent on the ambient temperature and the thermal resistance of the PCB. TI provides a thermal derating curve in the datasheet to help determine the maximum power dissipation for a given application.
  • The TPA3255DDV has built-in overvoltage protection, but it's still important to add external protection circuitry to prevent damage from voltage transients. A voltage supervisor or reset IC can be used to monitor the supply voltage and reset the device if it falls outside the recommended range.
  • The recommended heatsink for the TPA3255DDV depends on the specific application and power dissipation requirements. TI provides thermal resistance data in the datasheet to help determine the required heatsink size and type. A good starting point is to use a heatsink with a thermal resistance of 10°C/W or lower.

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TPA3255DDV Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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