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TPA3255TDDVRQ1 - Texas Instruments

Description: 315W-stereo / 600W-mono ultra-HD analog-input automotive class-D amplifier

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TPA3255TDDVRQ1 Details

  • Manufacturer Part Number:

    TPA3255TDDVRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2019-03-17

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • JESD-30 Code:

    R-PDSO-G44

  • JESD-609 Code:

    e4

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Noise Figure-Nom:

    112 dB

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    44

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    315 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    11.4 V

  • Supply Voltage-Min (Vsup):

    9.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

TPA3255TDDVRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the TPA3255TDDVRQ1 involves keeping the power traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. TI provides a recommended PCB layout in the datasheet and application notes.
  • To optimize thermal performance, ensure good airflow around the device, use a heat sink if possible, and avoid blocking the thermal pads on the bottom of the package. TI also recommends using thermal interface material (TIM) to improve heat transfer.
  • TI recommends using a 10uF to 22uF decoupling capacitor between the PVCC and PGND pins, and a 0.1uF to 1uF decoupling capacitor between the AVCC and AGND pins. The capacitors should be placed close to the device.
  • The gain of the TPA3255TDDVRQ1 can be configured using external resistors. TI provides a gain calculation formula in the datasheet, and also offers a gain configuration tool on their website.
  • The TPA3255TDDVRQ1 can handle up to 100W of continuous power, but this depends on the thermal design and heat sinking. TI provides thermal derating curves in the datasheet to help determine the maximum power handling.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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