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TPA6100A2D - Texas Instruments

Description: 50-mW Ultra Low-Voltage Stereo Headphone Audio Amplifier

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TPA6100A2D - Texas Instruments - PCB symbol
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PCB Footprints
TPA6100A2D - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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TPA6100A2D - Texas Instruments - 3D model - Small Outline Packages - D0008A
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TPA6100A2D Details

  • Manufacturer Part Number:

    TPA6100A2D

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Harmonic Distortion:

    0.1%

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    0.05 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    1.2 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.6 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TPA6100A2D Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TPA6100A2D datasheet, which includes guidelines for component placement, trace routing, and thermal management. It's essential to follow these guidelines to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The gain setting of the TPA6100A2D depends on the input signal level and the desired output power. The datasheet provides a gain setting table, and you can use the formula: Gain (dB) = 20 * log10 (Vout / Vin) to calculate the required gain. You can also use the TI Audio Amplifier Gain Calculator tool to simplify the process.
  • The maximum power dissipation of the TPA6100A2D depends on the ambient temperature and the thermal resistance of the PCB. According to the datasheet, the maximum power dissipation is 2.5W at a junction temperature of 150°C. You can use the thermal derating curve in the datasheet to determine the maximum power dissipation for your specific application.
  • The TPA6100A2D has built-in overvoltage protection (OVP) and undervoltage protection (UVP) circuits. However, it's still recommended to add external protection components, such as a voltage regulator and a power-on reset circuit, to ensure that the device operates within the recommended voltage range.
  • The recommended input coupling capacitor value depends on the input signal frequency and the desired high-pass filter cutoff frequency. A general rule of thumb is to use a capacitor value between 1uF and 10uF. The datasheet provides more detailed information on input coupling capacitor selection.

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TPA6100A2D Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like TPA61, or try a keyword search, such as Audio/Video Amplifiers

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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