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TPA6100A2DGKR - Texas Instruments

Description: 50-mW Ultra Low-Voltage Stereo Headphone Audio Amplifier

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TPA6100A2DGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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TPA6100A2DGKR - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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TPA6100A2DGKR Details

  • Manufacturer Part Number:

    TPA6100A2DGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Harmonic Distortion:

    0.1%

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    0.05 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    1.2 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.6 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TPA6100A2DGKR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TPA6100A2DGKR evaluation module documentation, which includes guidelines for component placement, trace routing, and thermal management to ensure optimal performance and minimize noise.
  • The gain setting depends on the input signal level and the desired output power. The TPA6100A2DGKR has a gain range of 10dB to 30dB. A higher gain setting can provide more output power, but may also increase noise and distortion. A lower gain setting can provide a cleaner signal, but may not provide enough output power. Consult the datasheet and application notes for guidance on selecting the optimal gain setting for your specific application.
  • The maximum power dissipation of the TPA6100A2DGKR is dependent on the ambient temperature and the thermal resistance of the PCB. According to the datasheet, the maximum power dissipation is 2.5W at an ambient temperature of 25°C. However, this can be derated to 1.5W at an ambient temperature of 85°C. It's essential to ensure proper thermal management to prevent overheating and ensure reliable operation.
  • The TPA6100A2DGKR has built-in ESD protection, but it's still essential to follow proper handling and assembly procedures to prevent ESD damage. Additionally, the device has overvoltage protection up to 12V, but it's recommended to use external protection circuitry, such as TVS diodes or voltage regulators, to ensure the device is protected from voltage transients and surges.
  • The recommended input and output coupling capacitor value depends on the specific application and the frequency range of interest. A general guideline is to use a capacitor value between 1uF to 10uF for input and output coupling. However, it's essential to consult the datasheet and application notes for specific guidance on capacitor selection and to ensure that the capacitor value does not affect the device's frequency response or stability.

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TPA6100A2DGKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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