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TPA6110A2DGNR - Texas Instruments

Description: 150-mW Stereo Headphone Audio Amplifier, Pin Compatible with LM4881

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TPA6110A2DGNR - Texas Instruments - PCB symbol
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TPA6110A2DGNR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN0008D
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TPA6110A2DGNR - Texas Instruments - 3D model - Small Outline Packages - DGN0008D
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TPA6110A2DGNR Details

  • Manufacturer Part Number:

    TPA6110A2DGNR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Harmonic Distortion:

    0.1%

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    0.15 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    3 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TPA6110A2DGNR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TPA6110A2DGNR involves keeping the audio signal traces short and away from the power supply traces, using a solid ground plane, and placing the decoupling capacitors close to the device. TI provides a recommended PCB layout in the datasheet and application notes.
  • The gain setting depends on the input signal level and the desired output power. A higher gain setting can provide more output power, but may also increase noise and distortion. A lower gain setting can provide a cleaner signal, but may not provide enough output power. TI provides a gain calculation formula in the datasheet.
  • The maximum power dissipation of the TPA6110A2DGNR is dependent on the ambient temperature and the thermal resistance of the PCB. TI provides a thermal derating curve in the datasheet to help estimate the maximum power dissipation.
  • The TPA6110A2DGNR has built-in overvoltage protection, but it's still recommended to add external protection circuitry, such as a voltage regulator and a crowbar circuit, to protect the device from overvoltage and undervoltage conditions.
  • The recommended input coupling capacitor value depends on the input signal frequency and amplitude. A general rule of thumb is to use a capacitor with a value of at least 10uF to ensure a flat frequency response.

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TPA6110A2DGNR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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