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TPA6112A2DGQR - Texas Instruments

Description: 150-mW Stereo Headphone Audio Amplifier with Differential Input

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TPA6112A2DGQR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGQ (S-PDSO-G10)
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TPA6112A2DGQR - Texas Instruments  - 3D model - Small Outline Packages - DGQ (S-PDSO-G10)
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TPA6112A2DGQR Details

  • Manufacturer Part Number:

    TPA6112A2DGQR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Gain:

    10 dB

  • Harmonic Distortion:

    0.1%

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    0.15 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    3 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TPA6112A2DGQR Frequently Asked Questions (FAQs)

  • According to TI's application notes, a 10uF ceramic capacitor and a 1uF ceramic capacitor in parallel, placed close to the power pins, are recommended for power supply decoupling.
  • The gain setting depends on the input signal level and the desired output power. TI recommends using the gain equation provided in the datasheet to calculate the optimal gain setting for your specific application.
  • The maximum power dissipation of the TPA6112A2DGQR is 2.5W. However, this value can be affected by the ambient temperature, PCB layout, and other factors. TI recommends following the thermal design guidelines in the datasheet to ensure reliable operation.
  • Yes, the TPA6112A2DGQR can be used in a bridged configuration to increase the output power. However, TI recommends following the specific bridging configuration guidelines in the datasheet to ensure proper operation and to avoid damage to the device.
  • TI recommends following the PCB layout guidelines in the datasheet, which include keeping the power supply traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device.

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TPA6112A2DGQR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TPA6112A2DGQ Texas Instruments

Audio Amplifier, 0.15W, 2 Channel(s), 1 Func, CMOS, PDSO10