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TPA6136A2YFFR - Texas Instruments

Description: 25-mW DirectPath™ Stereo Headphone Amplifier with Pop Suppression (WCSP)

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PCB Footprints
TPA6136A2YFFR - Texas Instruments PCB footprint - Other - Other - BGA16C40P4X4_156X156X63
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3D Models
TPA6136A2YFFR - Texas Instruments  - 3D model - Other - BGA16C40P4X4_156X156X63
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TPA6136A2YFFR Details

  • Manufacturer Part Number:

    TPA6136A2YFFR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    16

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Harmonic Distortion:

    1%

  • JESD-30 Code:

    S-PBGA-B16

  • JESD-609 Code:

    e1

  • Length:

    1.905 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    0.025 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA16,4X4,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.625 mm

  • Supply Current-Max:

    2.9 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.905 mm

TPA6136A2YFFR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, which includes guidelines for component placement, trace routing, and thermal management. Additionally, the TI website offers a PCB layout example and a thermal design guide for the TPA6136A2YFFR.
  • The gain setting for the TPA6136A2YFFR depends on the specific application requirements. TI provides a gain calculation formula in the datasheet, which takes into account the input signal level, output power, and desired gain. Engineers can use this formula to determine the optimal gain setting for their design.
  • The maximum power dissipation for the TPA6136A2YFFR is dependent on the ambient temperature and the thermal resistance of the PCB. TI provides a power dissipation calculation formula in the datasheet, which engineers can use to determine the maximum power dissipation for their specific design.
  • To ensure EMI compliance with the TPA6136A2YFFR, engineers should follow proper PCB layout and design practices, such as using a solid ground plane, minimizing trace lengths, and using shielding and filtering components as needed. TI also provides EMI compliance guidelines and test results in the datasheet and application notes.
  • The recommended input capacitor value for the TPA6136A2YFFR depends on the specific application requirements and the input signal frequency. TI provides guidelines for input capacitor selection in the datasheet, which include using a capacitor with a value between 1uF and 10uF, and a voltage rating that matches the input signal voltage.

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TPA6136A2YFFR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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