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TPA6211A1DGN - Texas Instruments

Description: Audio Amp Speaker 1-CH Mono 2.45W Class-AB 8-Pin HVSSOP EP Tube

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TPA6211A1DGN - Texas Instruments - PCB symbol
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PCB Footprints
TPA6211A1DGN - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - MSOP9_3.1X3.1X0.65
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TPA6211A1DGN - Texas Instruments - 3D model - Small Outline Packages - MSOP9_3.1X3.1X0.65
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TPA6211A1DGN Details

  • Manufacturer Part Number:

    TPA6211A1DGN

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS AB AUDIO AMPLIFIER

  • Harmonic Distortion:

    10%

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Noise Figure-Nom:

    105 dB

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    3.1 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TPA6211A1DGN Frequently Asked Questions (FAQs)

  • A good PCB layout for the TPA6211A1DGN involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended layout in the datasheet and application notes.
  • The gain setting depends on the specific application requirements. The TPA6211A1DGN has a fixed gain of 20 dB, but you can adjust the gain by adding external resistors. TI provides a gain calculation formula in the datasheet to help you determine the correct resistor values.
  • The maximum power dissipation of the TPA6211A1DGN is 2.5 W. You can calculate the power dissipation using the formula: Pd = (Vcc x Icc) + (Vout x Iout). Make sure to keep the device within the recommended operating temperature range to avoid overheating.
  • To filter out noise and EMI, use a combination of passive components such as capacitors, inductors, and resistors. You can also use active filters like the TPA6211A1DGN's built-in high-pass filter. Additionally, ensure good PCB layout practices, such as separating analog and digital grounds, and using shielding and grounding techniques.
  • TI recommends using a 10 μF ceramic capacitor and a 100 nF ceramic capacitor in parallel, placed close to the device's power pins. This helps to filter out noise and ripple on the power supply lines.

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TPA6211A1DGN Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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