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TPA6211TDGNRQ1 - Texas Instruments

Description: Audio Amplifiers Automotive, 3.1-W, mono, analog input class-AB audio amplifier 8-HVSSOP -40 to 105

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TPA6211TDGNRQ1 - Texas Instruments - PCB symbol
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TPA6211TDGNRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN (S-PDSO-G8)-
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TPA6211TDGNRQ1 - Texas Instruments - 3D model - Small Outline Packages - DGN (S-PDSO-G8)-
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TPA6211TDGNRQ1 Details

  • Manufacturer Part Number:

    TPA6211TDGNRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2020-04-10

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS AB AUDIO AMPLIFIER

  • Harmonic Distortion:

    10%

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Noise Figure-Nom:

    105 dB

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    3.1 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TPA6211TDGNRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the TPA6211TDGNRQ1 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended layout in the datasheet and application notes.
  • The gain setting for the TPA6211TDGNRQ1 depends on the specific application and desired output power. TI provides a gain calculation formula in the datasheet, and engineers can use online calculators or simulation tools to determine the optimal gain setting.
  • The TPA6211TDGNRQ1 has a thermal pad that must be connected to a heat sink or a thermal relief pattern on the PCB. Engineers should ensure good thermal conductivity and consider thermal management techniques such as heat sinks, thermal interfaces, and airflow to prevent overheating.
  • To filter out noise and EMI, engineers can use a combination of techniques such as using a common-mode choke, adding EMI filters, and shielding the audio circuit. TI provides guidance on EMI reduction in the datasheet and application notes.
  • The TPA6211TDGNRQ1 requires a specific power sequencing to prevent damage. Engineers should ensure that the power supply voltage (VCC) is applied before the audio signal, and that the device is powered down in the reverse order.

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TPA6211TDGNRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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