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TPA741DGNR - Texas Instruments

Description: 700-mW Mono, Differential Input, Class-AB Audio Amplifier with Active High Shutdown and Depop

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TPA741DGNR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN (S-PDSO-G8)(1)
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TPA741DGNR - Texas Instruments  - 3D model - Small Outline Packages - DGN (S-PDSO-G8)(1)
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TPA741DGNR Details

  • Manufacturer Part Number:

    TPA741DGNR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Harmonic Distortion:

    0.5%

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    0.7 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    2.5 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TPA741DGNR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends using a 10uF capacitor in parallel with a 0.1uF capacitor, placed as close as possible to the power pins, to ensure stable operation.
  • To minimize noise and ensure optimal performance, keep the input traces short and away from the output traces, use a solid ground plane, and place the amplifier close to the power supply decoupling capacitors.
  • The maximum power dissipation of the TPA741DGNR is 2.5W, and it's essential to ensure that the device is properly heat-sinked to prevent overheating.
  • Yes, the TPA741DGNR can be used in a bridged configuration to increase the output power, but it's essential to follow the recommended design guidelines and ensure that the device is properly heat-sinked.
  • The recommended input impedance for the TPA741DGNR is 47kΩ, but it can be adjusted to match the specific application requirements.

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TPA741DGNR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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