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TPA751DGN - Texas Instruments

Description: Texas Instruments TPA751DGN Speaker Audio Amplifier, Class-AB Mono 1.4MHz, 8-Pin MSOP

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TPA751DGN - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN (S-PDSO-G8)(1)
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TPA751DGN - Texas Instruments  - 3D model - Small Outline Packages - DGN (S-PDSO-G8)(1)
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TPA751DGN Details

  • Manufacturer Part Number:

    TPA751DGN

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    DEVICE FEATURES SHUTDOWN MODE FOR POWER SENSITIVE APPLICATIONS

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Harmonic Distortion:

    0.5%

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    0.7 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    2.5 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TPA751DGN Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer to help dissipate heat. Additionally, it's recommended to use thermal vias to connect the thermal pad to the ground plane.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines in the datasheet. Additionally, use a low-ESR capacitor for the power supply decoupling and keep the input and output traces short and away from each other.
  • The maximum power dissipation of the TPA751DGN is dependent on the ambient temperature and the thermal resistance of the PCB. According to the datasheet, the maximum power dissipation is 2.5W at 25°C ambient temperature. However, this can be derated to 1.5W at 85°C ambient temperature.
  • Yes, the TPA751DGN can be used in a bridged configuration to increase the output power. However, this requires careful consideration of the power supply voltage, output impedance, and thermal management. Consult the datasheet and application notes for more information.
  • The recommended input impedance for the TPA751DGN is 10kΩ to 20kΩ. This helps to ensure a stable input stage and optimal frequency response.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TPA751DGNG4 Texas Instruments

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