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TPD3S713QRVCRQ1 - Texas Instruments

Description: USB Interface IC Automotive USB 2.0 interface protection with adjustable current limit and short-to-VBATT protection 20-WQFN -40 to 125

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PCB Footprints
TPD3S713QRVCRQ1 - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RVC0020A
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3D Models
TPD3S713QRVCRQ1 - Texas Instruments  - 3D model - Quad Flat No-Lead - RVC0020A
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TPD3S713QRVCRQ1 Details

  • Manufacturer Part Number:

    TPD3S713QRVCRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2020-06-11

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    USB PD CONTROLLER

  • JESD-30 Code:

    R-PQCC-N20

  • JESD-609 Code:

    e4

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC20,.11X.15,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    0.28 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +3.9V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TPD3S713QRVCRQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as keeping the input and output traces short, using a solid ground plane, and minimizing noise coupling. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The TPD3S713QRVCRQ1 requires a 3.3V or 5V power supply, and it's essential to ensure the power supply is clean and stable. A decoupling capacitor (e.g., 10uF) should be placed close to the device's power pins. Additionally, the device's bias pins (e.g., VREF) should be connected to a stable voltage reference, such as a voltage regulator or a voltage divider.
  • The TPD3S713QRVCRQ1 is a high-speed device that can support data rates up to 3.2 Gbps. However, the actual data rate may be limited by the system's signal integrity, PCB layout, and other factors. It's essential to perform signal integrity analysis and simulation to ensure the device can operate at the desired data rate.
  • To troubleshoot issues with the TPD3S713QRVCRQ1, start by reviewing the device's datasheet and application notes. Check the PCB layout, power supply, and signal integrity. Use oscilloscopes and logic analyzers to debug the signal waveforms and timing. If the issue persists, contact Texas Instruments' technical support or consult with a experienced engineer.
  • The TPD3S713QRVCRQ1 is rated for operation up to 85°C (junction temperature). However, it's essential to ensure the device is properly cooled and the system is designed to operate within the specified temperature range. Exceeding the recommended temperature range may affect the device's performance, reliability, and lifespan.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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