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TPS2013DR - Texas Instruments

Description: Power Switch/Driver 1:1 N-Channel 1.5A 8-SOIC

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TPS2013DR - Texas Instruments - PCB symbol
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PCB Footprints
TPS2013DR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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3D Models
TPS2013DR - Texas Instruments - 3D model - Small Outline Packages - D0008A
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TPS2013DR Details

  • Manufacturer Part Number:

    TPS2013DR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    1994-12-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    3.9

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.7 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    0.1 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TPS2013DR Frequently Asked Questions (FAQs)

  • The TPS2013DR can operate from -40°C to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C.
  • The TPS2013DR has an internal power-on reset (POR) circuit that ensures the device is properly powered up and initialized. However, it's recommended to add an external capacitor (typically 1-10uF) between the VIN pin and GND to filter out noise and ensure a clean power-up sequence.
  • To minimize EMI and noise, it's recommended to place the TPS2013DR close to the power source, use a solid ground plane, and keep the input and output traces short and separate. Additionally, adding a ferrite bead or a common-mode choke can help filter out high-frequency noise.
  • Yes, the TPS2013DR is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard for automotive grade and is also suitable for industrial and medical applications that require high reliability.
  • The power dissipation of the TPS2013DR can be calculated using the formula: Pd = (VIN - VOUT) x IOUT. The thermal resistance (RθJA) is typically around 45°C/W for the TPS2013DR. You can use the thermal resistance to estimate the junction temperature (TJ) using the formula: TJ = TA + (RθJA x Pd).

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TPS2013DR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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