SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Seated Height-Max:
1.1 mm
Supply Current-Max (Isup):
0.12 mA
Supply Voltage-Max (Vsup):
5.5 V
Supply Voltage-Min (Vsup):
4.5 V
Supply Voltage-Nom (Vsup):
5 V
Surface Mount:
YES
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
3 mm
TPS2062CDGNR Frequently Asked Questions (FAQs)
The maximum capacitance depends on the application and the desired performance. However, as a general guideline, TI recommends using capacitors with a capacitance value between 1uF to 10uF. Larger capacitance values can be used, but may affect the stability and transient response of the device.
To ensure stability, follow the layout guidelines in the datasheet, use a low-ESR capacitor, and minimize the distance between the capacitor and the device. Additionally, ensure that the input and output capacitors are properly decoupled, and the device is operated within its recommended operating conditions.
The maximum input voltage for the TPS2062CDGNR is 5.5V. Exceeding this voltage can cause damage to the device. It's recommended to operate the device within its recommended operating conditions to ensure reliable operation.
The TPS2062CDGNR is rated for operation up to 85°C. However, the device's performance and reliability may degrade at higher temperatures. If you need to operate the device in a high-temperature environment, consider using a heat sink or a thermally-enhanced package.
The output voltage of the TPS2062CDGNR is determined by the resistor divider network connected to the FB pin. Use the equation: Vout = 1.25V x (R1 + R2) / R2, where R1 and R2 are the resistors in the divider network.
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TPS2062CDGNR Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
