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TPS2069DGN - Texas Instruments

Description: Current-Limited, Power-Distribution Switch

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TPS2069DGN - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN0008C
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TPS2069DGN - Texas Instruments  - 3D model - Small Outline Packages - DGN0008C
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TPS2069DGN Details

  • Manufacturer Part Number:

    TPS2069DGN

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    UNDERVOLTAGE LOCKOUT

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.7 V

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.07 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TPS2069DGN Frequently Asked Questions (FAQs)

  • The maximum current rating of the TPS2069DGN is 2A per channel, with a total current limit of 4A for both channels combined.
  • To ensure safe operation in high-temperature environments, ensure that the device is properly heatsinked, and the thermal pad is connected to a copper plane on the PCB. Also, follow the recommended layout and thermal design guidelines provided in the datasheet.
  • The EN (enable) pin is used to enable or disable the device. When EN is high, the device is enabled, and when EN is low, the device is disabled. This pin can be used to implement power-saving modes or to control the device's operation.
  • The TPS2069DGN has a specific power sequencing requirement. The input voltage (VIN) should be applied before the enable signal (EN) is asserted. This ensures proper device operation and prevents damage to the device.
  • The recommended PCB layout for the TPS2069DGN involves placing the device close to the power source, using wide traces for power and ground, and minimizing the distance between the device and the decoupling capacitors. A 4-layer PCB with a solid ground plane is recommended.

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TPS2069DGN Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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