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TPS22904YFPR - Texas Instruments

Description: 3.6-V, 0.5-A, 68mΩ load switch with quick output discharge

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TPS22904YFPR - Texas Instruments - PCB symbol
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PCB Footprints
TPS22904YFPR - Texas Instruments PCB footprint - Other - Other - BGA4C40P2X2_77X77X50
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TPS22904YFPR - Texas Instruments - 3D model - Other - BGA4C40P2X2_77X77X50
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TPS22904YFPR Details

  • Manufacturer Part Number:

    TPS22904YFPR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    Load switch

  • Input Voltage-Max:

    3.6 V

  • Input Voltage-Min:

    1.1 V

  • JESD-30 Code:

    S-PBGA-B4

  • JESD-609 Code:

    e1

  • Length:

    0.77 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.5 mm

  • Supply Current-Max (Isup):

    0.001 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.1 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.77 mm

TPS22904YFPR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TPS22904YFPR involves placing the input capacitors close to the VIN pin, using a solid ground plane, and keeping the high-current paths short and wide. Additionally, it's recommended to use a thermal relief pattern for the exposed pad to ensure good thermal performance.
  • To ensure proper thermal management, it's essential to provide a good thermal path from the device to a heat sink or a thermal pad. The exposed pad on the TPS22904YFPR should be soldered to a thermal pad or a heat sink, and the PCB should be designed to minimize thermal resistance.
  • The recommended input capacitor type for the TPS22904YFPR is a low-ESR ceramic capacitor with a value of 10uF to 22uF. The capacitor should be placed close to the VIN pin to minimize inductance and ensure good noise filtering.
  • The enable pin (EN) of the TPS22904YFPR is an active-high input. It should be driven high to enable the device and low to disable it. A pull-up resistor is recommended to ensure the pin is not left floating. The EN pin can also be tied to VIN if it's not used.
  • The maximum output current of the TPS22904YFPR is 4A. However, the actual output current may be limited by the thermal performance of the device and the PCB design. It's essential to ensure good thermal management to achieve the maximum output current.

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TPS22904YFPR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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