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TPS22963CYZPT - Texas Instruments

Description: 5.5-V, 3-A, 13.8mΩ load switch with reverse current protection

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PCB Footprints
TPS22963CYZPT - Texas Instruments PCB footprint - BGA - BGA - YZP0006 DSBGA - 0.5 mm max height
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3D Models
TPS22963CYZPT - Texas Instruments  - 3D model - BGA - YZP0006 DSBGA - 0.5 mm max height
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TPS22963CYZPT Details

  • Manufacturer Part Number:

    TPS22963CYZPT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1 V

  • JESD-30 Code:

    R-XBGA-B6

  • JESD-609 Code:

    e1

  • Length:

    1.442 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA6,2X3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.5 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    1.1 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.942 mm

TPS22963CYZPT Frequently Asked Questions (FAQs)

  • A good PCB layout for the TPS22963CYZPT involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper power-up and power-down of the TPS22963CYZPT, it's recommended to follow a controlled power-up sequence, where the input voltage is applied before the enable signal. During power-down, the enable signal should be turned off before the input voltage is removed. This helps prevent unwanted current surges and ensures a clean shutdown.
  • The TPS22963CYZPT has a thermal pad that must be connected to a solid ground plane to ensure proper heat dissipation. Additionally, the device should be mounted on a PCB with a thermal relief pattern to help dissipate heat. It's also recommended to keep the device away from other heat sources and to use a heat sink if necessary.
  • To troubleshoot issues with the TPS22963CYZPT, start by checking the input voltage and current, as well as the output voltage and current. Verify that the device is properly powered up and powered down, and check for any signs of overheating. Use an oscilloscope to check for any unusual voltage or current waveforms, and consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • The TPS22963CYZPT has built-in ESD protection, but it's still important to follow proper ESD handling procedures when handling the device. This includes using an ESD wrist strap or mat, storing the device in an ESD-safe environment, and avoiding touching the device's pins or leads.

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TPS22963CYZPT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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