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TPS2376DDAR-HG4 - Texas Instruments

Description: Power Switch ICs - POE / LAN IEEE 802.3af PoE Hi Pwr PD CONTROLLER

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TPS2376DDAR-HG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DDA0008J
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TPS2376DDAR-HG4 - Texas Instruments  - 3D model - Small Outline Packages - DDA0008J
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TPS2376DDAR-HG4 Details

  • Manufacturer Part Number:

    TPS2376DDAR-HG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    PoE POWERED DEVICE CONTROLLER

  • Input Voltage-Max:

    57 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.89 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.68 mm

  • Supply Current-Max (Isup):

    0.6 mA

  • Supply Voltage-Max (Vsup):

    57 V

  • Supply Voltage-Nom (Vsup):

    48 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TPS2376DDAR-HG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also recommended to follow general high-frequency layout guidelines, such as keeping the power traces short and wide, using a solid ground plane, and minimizing vias and layer changes.
  • The input capacitor should be selected based on the input voltage, current, and frequency. A general rule of thumb is to use a capacitor with a capacitance value of at least 10uF and a voltage rating of at least 1.5 times the input voltage. Additionally, the capacitor should have a low ESR (Equivalent Series Resistance) to minimize power losses.
  • The TPS2376DDAR-HG4 has an operating temperature range of -40°C to 125°C, but the maximum ambient temperature range depends on the specific application and the thermal design of the system. It's recommended to follow the thermal design guidelines in the datasheet and to perform thermal simulations to ensure the device operates within its specified temperature range.
  • To troubleshoot issues with the TPS2376DDAR-HG4, start by checking the input voltage, current, and frequency, as well as the output voltage and current. Verify that the device is properly soldered and that the PCB layout is correct. Use an oscilloscope to check for voltage ripple, noise, or oscillations. Also, check the thermal design and ensure that the device is properly cooled. If the issue persists, consult the datasheet and application notes, or contact Texas Instruments support for further assistance.
  • The TPS2376DDAR-HG4 is a high-reliability device, but it's essential to follow the guidelines and recommendations in the datasheet and application notes to ensure the device operates within its specified parameters. Additionally, it's recommended to perform thorough testing and validation to ensure the device meets the specific requirements of the application. Texas Instruments also provides additional resources and support for high-reliability and safety-critical applications.

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TPS2376DDAR-HG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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