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TPS3808G09DBVT - Texas Instruments

Description: Texas Instruments TPS3808G09DBVT, Processor Supervisor 0.4 → 5 V, Reset Input, 6-Pin SOT-23

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PCB Footprints
TPS3808G09DBVT - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DBV0006A
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3D Models
TPS3808G09DBVT - Texas Instruments  - 3D model - SOT23 (6-Pin) - DBV0006A
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TPS3808G09DBVT Details

  • Manufacturer Part Number:

    TPS3808G09DBVT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    6

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    BAT BUP SW:N;MNL RST:N;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:Y;UV DET:N;WD:N;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Supply Current-Max (Isup):

    0.0057 mA

  • Supply Voltage-Max (Vsup):

    6.5 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +0.84V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

TPS3808G09DBVT Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the TPS3808G09DBVT involves placing the device close to the power source, using a solid ground plane, and keeping the input and output capacitors close to the device. Additionally, it is recommended to use a low-ESR capacitor for the input capacitor and to minimize the length of the traces between the device and the capacitors.
  • When choosing input and output capacitors for the TPS3808G09DBVT, consider the voltage rating, capacitance value, and equivalent series resistance (ESR). A minimum capacitance value of 1uF is recommended for the input capacitor, and a minimum capacitance value of 2.2uF is recommended for the output capacitor. The ESR of the capacitors should be as low as possible to minimize power losses.
  • The maximum ambient temperature range for the TPS3808G09DBVT is -40°C to 125°C. However, the device's performance and reliability may be affected at extreme temperatures, so it is recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance.
  • To ensure the TPS3808G09DBVT is properly powered up and powered down, follow the recommended power-up and power-down sequences outlined in the datasheet. The device should be powered up slowly, with a ramp-up time of at least 1ms, and powered down slowly, with a ramp-down time of at least 1ms.
  • The TPS3808G09DBVT has a thermal pad that must be connected to a solid ground plane to ensure proper heat dissipation. The device's junction temperature should be kept below 150°C to ensure reliable operation. A thermal interface material (TIM) can be used to improve heat transfer between the device and the PCB.

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TPS3808G09DBVT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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