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TPS3809L30DBVTG4 - Texas Instruments

Description: Supervisory Circuits 3-Pin Supply Voltage Supervisor

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TPS3809L30DBVTG4 - Texas Instruments PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - dbv-3
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TPS3809L30DBVTG4 - Texas Instruments  - 3D model - SOT23 (3-Pin) - dbv-3
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TPS3809L30DBVTG4 Details

  • Manufacturer Part Number:

    TPS3809L30DBVTG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Supply Current-Max (Isup):

    0.025 mA

  • Supply Voltage-Max (Vsup):

    6 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.64V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

TPS3809L30DBVTG4 Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the TPS3809L30DBVTG4 involves placing the device close to the power source, using a solid ground plane, and keeping the input and output capacitors close to the device. Additionally, it's recommended to use a Kelvin connection for the sense pins to minimize noise and ensure accurate voltage sensing.
  • To handle the power-up sequence for the TPS3809L30DBVTG4, it's recommended to power up the device in a controlled manner, such as using a soft-start circuit or a power-up sequencer. This helps to avoid voltage overshoot or undershoot and ensures a stable output voltage.
  • The TPS3809L30DBVTG4 is designed to operate over a wide temperature range (-40°C to 125°C), but temperature can still affect its accuracy and stability. The device's accuracy may degrade at higher temperatures, and the output voltage may drift slightly. However, the device is designed to maintain its accuracy within the specified limits over the entire operating temperature range.
  • To troubleshoot issues with the TPS3809L30DBVTG4, start by checking the input voltage, output voltage, and sense pins for any anomalies. Verify that the device is properly powered and that the input and output capacitors are properly connected. Check for any signs of overheating, and ensure that the device is operated within its specified limits. If the issue persists, consult the datasheet and application notes for further guidance.
  • The TPS3809L30DBVTG4 is designed to meet the requirements of high-reliability and safety-critical applications. It's built with a robust design and has undergone rigorous testing to ensure its reliability and performance. However, it's essential to follow proper design and testing procedures to ensure that the device meets the specific requirements of the application.

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TPS3809L30DBVTG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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