Texas Instruments recommends a compact layout with the device placed close to the power source, and the input capacitor (CIN) placed as close as possible to the VIN pin. The output capacitor (COUT) should be placed close to the VOUT pin. A 4-layer PCB with a solid ground plane is recommended to minimize noise and improve performance.
Choose input capacitors (CIN) with a low ESR (Equivalent Series Resistance) and a high ripple current rating. For output capacitors (COUT), select ones with a low ESR and a high capacitance value. The recommended values are CIN = 10uF, 16V, X5R or X7R, and COUT = 22uF, 16V, X5R or X7R.
The EN (Enable) pin is used to turn the device on or off. When EN is high (logic level), the device is enabled, and when EN is low (logic level), the device is disabled. Connect EN to VIN or a logic signal to control the device's operation.
The PG output signal is an open-drain output that indicates when the output voltage is within the specified regulation range. Connect a pull-up resistor (e.g., 10kΩ) to a voltage rail (e.g., VOUT) to use the PG signal as a power-good indicator.
The thermal derating for the TPS3823-50DBVTG4 is based on the junction temperature (TJ). Calculate the maximum allowed power dissipation using the formula: Pd(max) = (TJ(max) - TA) / θJA, where TJ(max) = 150°C, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance (45°C/W for the DBVT package).
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
