A good PCB layout is crucial for the TPS65400RGZT. TI recommends a 4-layer PCB with a solid ground plane, and the use of vias to connect the top and bottom layers. Keep the input and output capacitors close to the IC, and use short, wide traces for the power lines. Avoid routing sensitive analog signals near the switching node.
Choose input capacitors with low ESR (Equivalent Series Resistance) and high ripple current rating. For output capacitors, select ones with low ESR, high capacitance, and a voltage rating that exceeds the output voltage. TI recommends using ceramic or polymer capacitors with X5R or X7R dielectrics.
The maximum ambient temperature for the TPS65400RGZT is 85°C. As the temperature increases, the device's performance may degrade, and the output voltage may drop. Ensure good airflow and heat sinking to keep the device within its recommended operating temperature range.
The TPS65400RGZT has a fixed output voltage option, but you can also use an external resistor divider network to set the output voltage. The output voltage range is 0.9V to 3.3V, and the maximum output current is 2A. Be aware of the device's voltage accuracy and line regulation limitations when selecting the output voltage.
To minimize EMI and noise, use a shielded inductor, keep the switching node away from sensitive analog signals, and use a common-mode choke or ferrite bead on the input and output lines. Additionally, ensure good PCB layout practices, such as using a solid ground plane and minimizing loop areas.
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
