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TRSF3221ECDB - Texas Instruments

Description: Texas Instruments TRSF3221ECDB, Line Transceiver, RS-232, 3 → 5.5 V, 16-Pin SSOP

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TRSF3221ECDB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DB (R-PDSO-G)
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TRSF3221ECDB - Texas Instruments  - 3D model - Small Outline Packages - DB (R-PDSO-G)
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TRSF3221ECDB Details

  • Manufacturer Part Number:

    TRSF3221ECDB

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    IT ALSO HAS 5V SUPPLY OPERATING RANGE

  • Differential Output:

    NO

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000001 A

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    6.2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Output Low Current-Max:

    0.0016 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    150 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    2 mm

  • Supply Current-Max:

    1 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.3 mm

TRSF3221ECDB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended layout and routing guide in the application note SLVAE04, which includes guidelines for PCB design, component placement, and signal routing to ensure optimal performance and minimize noise.
  • The TRSF3221ECDB has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. Ensure good thermal conductivity by using a thermal interface material and a heat sink if necessary. Refer to the thermal management section in the datasheet for more information.
  • The TRSF3221ECDB can support data rates up to 100 Mbps, but the actual data rate depends on the specific application, cable length, and signal quality. Consult the datasheet and application notes for more information on data rate limitations.
  • Yes, the TRSF3221ECDB is designed to support hot-swap and hot-plug applications. However, ensure that the power sequencing and voltage ramp-up times are within the recommended specifications to prevent damage to the device.
  • Texas Instruments provides a troubleshooting guide in the application note SLVAE03, which covers common issues, diagnostic techniques, and solutions for signal integrity and data corruption problems.

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TRSF3221ECDB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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