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TS3DV642RUARQ1 - Texas Instruments

Description: Multiplexer Switch ICs

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PCB Footprints
TS3DV642RUARQ1 - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RUA0042A
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3D Models
TS3DV642RUARQ1 - Texas Instruments  - 3D model - Quad Flat No-Lead - RUA0042A
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TS3DV642RUARQ1 Details

  • Manufacturer Part Number:

    TS3DV642RUARQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • JESD-30 Code:

    R-PQCC-N42

  • JESD-609 Code:

    e4

  • Length:

    9 mm

  • Moisture Sensitivity Level:

    2

  • Normal Position:

    NO

  • Number of Channels:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    42

  • Off-state Isolation-Nom:

    16 dB

  • On-state Resistance Match-Nom:

    6.5 Ω

  • On-state Resistance-Max (Ron):

    12 Ω

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC42,.14X.35,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-on Time-Max:

    5000 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.5 mm

TS3DV642RUARQ1 Frequently Asked Questions (FAQs)

  • A multi-layer PCB with a solid ground plane, thermal vias, and a heat sink is recommended. Ensure a low-ESR capacitor is placed close to the device for optimal decoupling.
  • Use a shielded cable, keep signal traces short, and avoid crossing signal lines over gaps in the ground plane. Implement EMI filters and shielding on the PCB to minimize emissions.
  • Operating beyond recommended conditions can lead to reduced reliability, increased power consumption, and potential device failure. Ensure operating conditions are within the specified range to maintain device performance and longevity.
  • Consult the datasheet and application notes for troubleshooting guidelines. Verify proper power supply, signal integrity, and PCB layout. Use oscilloscopes and logic analyzers to debug signal issues.
  • Implement redundant systems, error detection, and correction mechanisms. Ensure compliance with relevant industry standards and regulations. Perform thorough testing and validation to ensure device reliability and performance.

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TS3DV642RUARQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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