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TSB17BA1PW - Texas Instruments

Description: 1394 Interface IC UTP5 Equalizer for 1394b PHYs

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TSB17BA1PW - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW0024A
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TSB17BA1PW - Texas Instruments  - 3D model - Small Outline Packages - PW0024A
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TSB17BA1PW Details

  • Manufacturer Part Number:

    TSB17BA1PW

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    PLASTIC, TSSOP-24

  • Pin Count:

    24

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    IEEE 1394

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e4

  • Length:

    7.8 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    0.7 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    1.95 V

  • Supply Voltage-Min:

    1.65 V

  • Supply Voltage-Nom:

    1.8 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

TSB17BA1PW Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device can help to dissipate heat efficiently. It's also recommended to use a thermal pad on the bottom of the device.
  • Ensure that the device is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • The POR circuitry ensures that the device resets properly during power-up. However, it may introduce a brief delay in the device's startup time. Ensure that your system design takes this into account, especially if you have critical timing requirements.
  • Follow proper ESD handling procedures during device handling and assembly. Ensure that your PCB design includes ESD protection components, such as TVS diodes or ESD arrays, to protect the device from external ESD events.
  • Implement a robust design that includes redundant systems, error detection and correction mechanisms, and fault tolerance. Also, ensure that your design meets relevant industry standards and regulations, such as IEC 61508 or ISO 26262.

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TSB17BA1PW Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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