Part Image

TSB42AC3PZT - Texas Instruments

Description: Texas Instruments TSB42AC3PZT Physical Layer Transceiver, 100-Pin TQFP

Download TSB42AC3PZT Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
3D Models
TSB42AC3PZT - Texas Instruments  - 3D model
click to zoom
Note! To download footprints and symbols, use the build and request forms below

Build

Launch Build Wizard
Build Wizard not available for this package category!

Request (48 hours)

TSB42AC3PZT Details

  • Manufacturer Part Number:

    TSB42AC3PZT

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Pin Count:

    100

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Address Bus Width:

    8

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    50 MHz

  • Communication Protocol:

    IEEE1394

  • Data Transfer Rate-Max:

    50 MBps

  • External Data Bus Width:

    32

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e4

  • Length:

    14 mm

  • Low Power Mode:

    NO

  • Moisture Sensitivity Level:

    4

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP100,.63SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

TSB42AC3PZT Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout for the TSB42AC3PZT in the 'Layout' section of the datasheet. However, for optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane, and to place the device near a thermal pad or heat sink. Additionally, ensure that the PCB traces are wide enough to handle the high currents and that the device is placed in a well-ventilated area.
  • To ensure reliable operation at high temperatures, it is recommended to follow the guidelines in the 'Absolute Maximum Ratings' section of the datasheet. Additionally, ensure that the device is properly heatsinked, and that the PCB is designed to handle the high temperatures. It is also recommended to derate the device's power handling capabilities at high temperatures to prevent overheating.
  • The recommended input capacitor value and type for the TSB42AC3PZT depends on the specific application and operating conditions. However, as a general guideline, a 10uF to 22uF ceramic or film capacitor with a voltage rating of 50V or higher is recommended. The capacitor should be placed as close to the device's input pins as possible to minimize noise and ripple.
  • To troubleshoot common issues such as overheating or malfunction, start by checking the device's operating conditions, such as input voltage, output current, and ambient temperature. Ensure that the device is properly heatsinked and that the PCB is designed to handle the high currents. Check for any signs of physical damage or wear, and verify that the device is properly soldered to the PCB. If the issue persists, consult the datasheet and application notes for troubleshooting guidelines or contact Texas Instruments' technical support.
  • Using a different package type or variant of the TSB42AC3PZT may affect the device's thermal performance, power handling capabilities, and overall reliability. For example, the PQFN package type may have a higher thermal resistance than the TO-220 package type, which could affect the device's ability to handle high currents. Consult the datasheet and application notes for specific information on the differences between package types and variants, and ensure that the chosen package meets the requirements of the application.

Trust Checks

No trust score is available for this model.
Trust Score Unavailable
Sponsored

TSB42AC3PZT Overview

Use the download button to access the TSB42AC3PZT 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like TSB42, or try a keyword search, such as Serial IO/Communication Controllers

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to TSB42AC3PZT

Showing 0 results

Select Package Category

Package Categories

Datasheet PDF Preview