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TSB83AA23ZAY - Texas Instruments

Description: Integrated IEEE-1394.B OHCI Link and 3 Port S800 Phy

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PCB Footprints
TSB83AA23ZAY - Texas Instruments PCB footprint - BGA - BGA - ZAY (S-PBGA-N167)
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3D Models
TSB83AA23ZAY - Texas Instruments  - 3D model - BGA - ZAY (S-PBGA-N167)
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TSB83AA23ZAY Details

  • Manufacturer Part Number:

    TSB83AA23ZAY

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Pin Count:

    167

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    NETWORK PROTOCOL= IEEE1394B

  • Boundary Scan:

    YES

  • Bus Compatibility:

    PCI

  • Clock Frequency-Max:

    33 MHz

  • Communication Protocol:

    MIL STD 1553

  • Data Transfer Rate-Max:

    100 MBps

  • JESD-30 Code:

    S-PBGA-B167

  • JESD-609 Code:

    e1

  • Length:

    12 mm

  • Low Power Mode:

    NO

  • Moisture Sensitivity Level:

    3

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    167

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA167,14X14,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.4 mm

  • Supply Current-Max:

    120 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    12 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

TSB83AA23ZAY Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the center of the board, and the input and output traces should be kept short and away from noise sources.
  • Ensure good thermal design, including a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • The limited output current may require the use of external amplifiers or buffers to drive heavy loads. Ensure that the output current is within the specified limits to prevent device damage or malfunction.
  • Use a logic analyzer or oscilloscope to monitor the device's inputs and outputs. Check the power supply voltage, clock frequency, and input signal integrity. Consult the datasheet and application notes for troubleshooting guidelines.
  • The TSB83AA23ZAY is not specifically designed for radiation-hardened or high-reliability applications. Consult with Texas Instruments or a qualified radiation effects engineer to determine the device's suitability for such applications.

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TSB83AA23ZAY Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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