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UCC21710DW - Texas Instruments

Description: Gate Drivers ±10-A 5.7-kV RMS single channel i

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PCB Footprints
UCC21710DW - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW0016B 2021
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3D Models
UCC21710DW - Texas Instruments  - 3D model - Small Outline Packages - DW0016B 2021
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UCC21710DW Details

  • Manufacturer Part Number:

    UCC21710DW

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2020-08-21

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Current-Max:

    10 A

  • Output Peak Current Limit-Nom:

    10 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    33 V

  • Supply Voltage1-Min:

    13 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.13 µs

  • Turn-on Time:

    0.13 µs

  • Width:

    7.5 mm

UCC21710DW Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC21710DW involves keeping the high-frequency switching nodes (e.g., SW and VIN) away from sensitive analog nodes, using a solid ground plane, and minimizing loop areas. TI provides a recommended layout in the application note SLUA623.
  • When selecting a transformer for the UCC21710DW, consider the maximum output power, output voltage, and input voltage. The transformer's turns ratio, inductance, and core material should be chosen to ensure efficient energy transfer. TI provides guidelines for transformer selection in the application note SLUA622.
  • The maximum junction temperature for the UCC21710DW is 150°C. Exceeding this temperature can reduce the device's reliability and lifespan. Ensure proper thermal design and heat sinking to keep the junction temperature within the recommended range.
  • The UCC21710DW has a built-in overcurrent protection feature. Connect a sense resistor (Rs) between the source pin and the drain pin of the internal MOSFET. The device will shut down if the current exceeds the threshold set by Rs. Consult the datasheet for specific implementation details.
  • While the UCC21710DW is primarily designed for isolated topologies, it can be used in non-isolated configurations with some limitations. However, this may require additional components and design considerations to ensure safe operation. Consult TI's application notes and design guides for more information.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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