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UCC21750QDWQ1 - Texas Instruments

Description: Texas Instruments Automotive, single channel isolated gate driver for SiC/IGBT with advanced protection and high-CMTI 16-SOIC -40 to 125

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UCC21750QDWQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-16
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UCC21750QDWQ1 Details

  • Manufacturer Part Number:

    UCC21750QDWQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2019-10-03

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    NEG SUPPLY-NOM AT O/P SIDE IS -5V

  • High Side Driver:

    YES

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Current-Max:

    10 A

  • Output Peak Current Limit-Nom:

    10 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    33 V

  • Supply Voltage1-Min:

    13 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.13 µs

  • Turn-on Time:

    0.13 µs

  • Width:

    7.5 mm

UCC21750QDWQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC21750QDWQ1 involves keeping the high-frequency switching nodes (e.g., SW and VIN) away from sensitive analog nodes, using a solid ground plane, and minimizing the length of the power traces. TI provides a recommended PCB layout in the application note SLUA623.
  • To ensure the UCC21750QDWQ1 operates within its SOA, monitor the device's junction temperature (TJ) and ensure it does not exceed 150°C. Also, keep the input voltage (VIN) within the recommended range (4.5V to 18V), and avoid exceeding the maximum current ratings for the output (IOUT) and input (IIN).
  • When selecting LO and CO, consider the output voltage ripple, inductor core loss, and capacitor ESR. Choose an inductor with a high saturation current rating and low DCR. For CO, select a capacitor with low ESR and a voltage rating that exceeds the output voltage. TI provides guidance on component selection in the datasheet and application notes.
  • To troubleshoot issues with the UCC21750QDWQ1, start by verifying the PCB layout and component selection. Check for proper decoupling, correct component values, and ensure that the input voltage is within the recommended range. Use an oscilloscope to monitor the switching waveforms and output voltage. Consult the datasheet and application notes for guidance on troubleshooting common issues.
  • To manage thermal performance, ensure good airflow around the device, and consider using a heat sink or thermal pad to reduce the junction-to-ambient thermal resistance (RθJA). Keep the device away from heat sources and ensure that the PCB is designed to dissipate heat efficiently.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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