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UCC27324DGNRG4 - Texas Instruments

Description: Driver 4.5A 2-OUT Lo Side Non-Inv 8-Pin HVSSOP EP T/R

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UCC27324DGNRG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN0008D
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UCC27324DGNRG4 Details

  • Manufacturer Part Number:

    UCC27324DGNRG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Current-Max:

    4 A

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.07 mm

  • Supply Current-Max:

    0.75 mA

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    14 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.05 µs

  • Turn-on Time:

    0.04 µs

  • Width:

    3 mm

UCC27324DGNRG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLUA623, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • Proper thermal management is crucial for the UCC27324DGNRG4. Ensure good thermal conductivity by using a thermal pad or thermal interface material (TIM) between the device and the heat sink. Also, follow the recommended PCB layout and use a heat sink with a thermal resistance of less than 10°C/W to keep the junction temperature below 150°C.
  • The maximum allowed voltage on the input pins of the UCC27324DGNRG4 is 6V, which is the absolute maximum rating. However, it's recommended to keep the input voltage below 5.5V to ensure reliable operation and prevent damage to the device.
  • Yes, the UCC27324DGNRG4 is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q100 standard and is manufactured using a automotive-qualified process. However, it's essential to follow the recommended design and testing guidelines to ensure the device meets the specific requirements of your application.
  • To troubleshoot issues with the UCC27324DGNRG4, start by verifying the input voltage, output voltage, and feedback connections. Check for proper PCB layout, component values, and soldering quality. Use an oscilloscope to monitor the output voltage and current, and consult the application notes and datasheet for guidance on troubleshooting common issues.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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