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UCC5870QDWJQ1 - Texas Instruments

Description: UCC5870 Q1 Functional Safety Compliant 15 A Isolated IGBT SiC MOSFET Gate Driver with Advanced Protection Features for Automotive Applications

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UCC5870QDWJQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DWJ0036A-1
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UCC5870QDWJQ1 - Texas Instruments  - 3D model - Small Outline Packages - DWJ0036A-1
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UCC5870QDWJQ1 Details

  • Manufacturer Part Number:

    UCC5870QDWJQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2020-07-02

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G36

  • JESD-609 Code:

    e4

  • Length:

    12.83 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Current-Max:

    30 A

  • Output Peak Current Limit-Nom:

    30 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP36(UNSPEC)

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    3.55 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    30 V

  • Supply Voltage1-Min:

    15 V

  • Supply Voltage1-Nom:

    20 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.15 µs

  • Turn-on Time:

    0.15 µs

  • Width:

    7.5 mm

UCC5870QDWJQ1 Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer. This helps to dissipate heat efficiently. Additionally, ensure that the thermal pad is connected to a large copper area on the PCB to improve heat dissipation.
  • To ensure reliable operation across the entire operating temperature range, it is essential to follow proper PCB design and layout guidelines, use a suitable thermal interface material, and ensure that the device is properly soldered. Additionally, consider using a thermocouple or thermistor to monitor the device temperature and implement thermal protection mechanisms if necessary.
  • To mitigate EMI and RFI in your design, ensure that the UCC5870QDWJQ1 is placed away from noise-sensitive components, use a shielded enclosure, and implement proper filtering and shielding techniques. Additionally, consider using a common-mode choke and a ferrite bead to reduce EMI emissions.
  • To optimize the output filter design, consider the output voltage, current, and frequency requirements of your application. Use a combination of capacitors and inductors to achieve the desired output filter characteristics. Additionally, consider using a simulation tool or SPICE model to optimize the filter design and reduce the risk of oscillations or instability.
  • To ensure accurate testing and measurement, use a high-impedance probe or a differential probe to measure the output voltage and current. Ensure that the measurement equipment is properly calibrated and that the device is operated within its recommended operating conditions. Additionally, consider using a load bank or a resistive load to simulate the actual load conditions.

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UCC5870QDWJQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image UCC5870QDWJRQ1 Texas Instruments

Buffer or Inverter Based IGBT/MOSFET Driver, 30A, PDSO36