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UCD9240RGCR - Texas Instruments

Description: Digital PWM System Controller

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UCD9240RGCR - Texas Instruments - PCB symbol
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PCB Footprints
UCD9240RGCR - Texas Instruments PCB footprint - Other - Other - QFN50P900X900X100-65N
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3D Models
UCD9240RGCR - Texas Instruments - 3D model - Other - QFN50P900X900X100-65N
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UCD9240RGCR Details

  • Manufacturer Part Number:

    UCD9240RGCR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    64

  • Country Of Origin:

    Malaysia, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    3.6 V

  • Input Voltage-Min:

    3 V

  • Input Voltage-Nom:

    3.3 V

  • JESD-30 Code:

    S-PQCC-N64

  • JESD-609 Code:

    e4

  • Length:

    9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    4

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC64,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2000 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

UCD9240RGCR Frequently Asked Questions (FAQs)

  • TI recommends a 4-layer PCB with a solid ground plane on the bottom layer, and a thermal relief pattern on the top layer to improve heat dissipation. A minimum of 2 oz copper thickness is recommended for the top layer.
  • Use a dedicated clock signal for the UCD9240, and ensure the system controller's clock frequency is within the recommended range of 10-40 MHz. Also, use a pull-up resistor on the SDA line and a pull-down resistor on the SCL line to prevent bus contention.
  • The maximum allowed voltage on the VDD pin is 3.6V. Exceeding this voltage may cause permanent damage to the device. It's recommended to use a voltage regulator or a power supply with a tight tolerance to ensure the voltage remains within the recommended range.
  • The power-up sequence should be: VDD, then VCC, then EN. This ensures the internal regulators are enabled in the correct order. A power-up sequence violation may cause the device to malfunction or not function at all.
  • TI recommends a 1-10 μF ceramic capacitor with a voltage rating of 6.3V or higher. The capacitor should be placed as close as possible to the VCC pin to minimize noise and ensure stable operation.

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UCD9240RGCR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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