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UCD9240RGCT - Texas Instruments

Description: Digital PWM System Controller

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Symbol
UCD9240RGCT - Texas Instruments - PCB symbol
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PCB Footprints
UCD9240RGCT - Texas Instruments PCB footprint - Other - Other - QFN50P900X900X100-65N
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3D Models
UCD9240RGCT - Texas Instruments - 3D model - Other - QFN50P900X900X100-65N
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UCD9240RGCT Details

  • Manufacturer Part Number:

    UCD9240RGCT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    64

  • Country Of Origin:

    Malaysia, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    3.6 V

  • Input Voltage-Min:

    3 V

  • Input Voltage-Nom:

    3.3 V

  • JESD-30 Code:

    S-PQCC-N64

  • JESD-609 Code:

    e4

  • Length:

    9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    4

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC64,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2000 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

UCD9240RGCT Frequently Asked Questions (FAQs)

  • TI recommends a 4-layer PCB with a solid ground plane on the bottom layer, and a thermal relief pattern on the top layer to minimize thermal resistance. A thermal pad on the bottom of the device should be connected to the ground plane.
  • To ensure accurate current sensing, use a low-impedance current sense resistor (RSENSE) and place it as close to the device as possible. Also, ensure that the sense lines are routed away from noisy signals and that the PCB layout is symmetrical to minimize errors.
  • TI recommends a 10uF to 22uF ceramic capacitor (X5R or X7R dielectric) with a voltage rating of at least 2x the input voltage. The capacitor should be placed as close to the VIN pin as possible to minimize inductance.
  • The output voltage can be configured by selecting the appropriate resistor values for the feedback network (RFBT and RFBG). Use TI's online calculator or consult the datasheet for specific resistor values for your desired output voltage.
  • The UCD9240RGCT can deliver up to 4A of output current, but this is dependent on the input voltage, output voltage, and thermal conditions. Ensure that the device is properly heatsinked and that the input voltage is sufficient to support the desired output current.

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UCD9240RGCT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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