FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Sample Rate:
0.125 MHz
Seated Height-Max:
1.2 mm
Supply Current-Max:
12 mA
Supply Voltage-Min:
2.7 V
Supply Voltage-Nom:
2.5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
MILITARY
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.5 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
30
Width:
7 mm
V62/09626-01YE Frequently Asked Questions (FAQs)
Texas Instruments provides a recommended PCB layout and thermal management guide in their application notes (e.g., SLUAAC4) and design guides (e.g., TIDA-060013). It's essential to follow these guidelines to ensure optimal performance, reduce thermal resistance, and prevent overheating.
The selection of input and output capacitors depends on the specific application, operating frequency, and desired performance. TI provides guidance on capacitor selection in their application notes (e.g., SLUAAC4) and capacitor selection guides. In general, low-ESR capacitors with high ripple current ratings are recommended.
Operating the device beyond the recommended operating conditions can lead to reduced performance, increased power consumption, and potentially even damage to the device. It's essential to ensure that the device operates within the specified conditions to maintain reliability and performance.
TI provides troubleshooting guides and application notes (e.g., SLUAAC4) that cover common issues and their solutions. Additionally, engineers can use simulation tools like TI's WEBENCH or SPICE models to simulate and analyze the circuit behavior.
TI provides guidance on EMI and EMC considerations in their application notes (e.g., SLUAAC4) and design guides. Engineers should follow best practices for PCB layout, component selection, and shielding to minimize EMI and ensure compliance with regulatory standards like CISPR and FCC.
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V62/09626-01YE Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
