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W632GG8NB12I - Winbond

Description: 2Gb DDR3 SDRAM 1600MHz VFBGA78

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Symbol
W632GG8NB12I - Winbond - PCB symbol
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PCB Footprints
W632GG8NB12I - Winbond PCB footprint - BGA - BGA - VFBGA-78
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3D Models
W632GG8NB12I - Winbond - 3D model - BGA - VFBGA-78
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W632GG8NB12I Details

  • Manufacturer Part Number:

    W632GG8NB12I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    VFBGA-78

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.36

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    0

  • Access Mode:

    MULTI BANK PAGE BURST

  • Additional Feature:

    AUTO/SELF REFRESH

  • JESD-30 Code:

    R-PBGA-B78

  • Length:

    10.5 mm

  • Memory Density:

    2147483648 bit

  • Memory IC Type:

    DDR3 DRAM

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    78

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    95 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256MX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    1.575 V

  • Supply Voltage-Min (Vsup):

    1.425 V

  • Supply Voltage-Nom (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    8 mm

W632GG8NB12I Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the W632GG8NB12I can be found in the Winbond application note AN-001, which provides guidelines for PCB design, layout, and routing to ensure optimal performance and signal integrity.
  • The W632GG8NB12I has a thermal pad on the bottom of the package, which should be connected to a thermal pad on the PCB. A thermal interface material (TIM) can be used to improve heat transfer. Additionally, ensure good airflow around the device and consider using a heat sink if necessary.
  • The W632GG8NB12I has an industrial temperature range of -40°C to 85°C, but it's recommended to operate the device within a temperature range of 0°C to 70°C for optimal performance and reliability.
  • The W632GG8NB12I supports ECC (Error-Correcting Code) and parity checking. Implementing ECC requires additional hardware and software resources. Consult the datasheet and application notes for more information on implementing error correction and detection mechanisms.
  • The recommended power-up sequence for the W632GG8NB12I is to apply VCC first, followed by VPP, and then the clock signal. Ensure that the power supply is stable and within the recommended voltage range before applying the clock signal.

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W632GG8NB12I Overview

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